Our photolithography laboratory provides tools for ultraviolet lithography, nanoprinting, wafer bonding and thick film fabrication.
This ISO 5 Class 100 laboratory allows researchers to apply photolithography techniques appropriate for integrated devices, lab-on-a-chip research and microfluidics.
Photolithography selectively removes parts of a thin film set upon a substrate enabling the subsequent patterning of that substrate. By combining ultraviolet light chosen for its short wavelength and consequent fine resolution capabilities with modern thin film polymer engineering, resolutions across eight inch wafers to 750 nm are routine. Similar refinements in manipulation and material choices allow fabrication structures across eight inch wafers to 10 nm resolution.
- Mask Aligner (LMA)
- Mask Aligner with NIL and BS Align (HMA)
- Spin and Spray Coater (HSC)
Mask Aligner (LMA)
The SUSS MA6 enables standard lithography applications, with the capability of high resolution optics and optimum edge for thick resist MicroElectroMechanical (MEMS) applications. The special bottom side alignment option allows for pattern printing on both sides of the substrate.
Mask Aligner with NIL and BS align (HMA)
The EVG 610 is a versatile mask alignment system for performing standard UV lithography in addition to Nano Imprint Lithography.
Spin and Spray Coater (HSC)
The EVG101 is a spin and spray coat system used to apply a range of photosensitive materials to substrates.
The laboratory also contains a broad range of tools to assist researchers in using the equipment. Full details are provided in the training modules and manuals for the laboratory.